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SA57022-XX 500 mA LDO with ON/OFF control and Vref bypass
Product data Supersedes data of 2001 Oct 03 2003 Oct 13
Philips Semiconductors
Philips Semiconductors
Product data
500 mA LDO with ON/OFF control and Vref bypass
SA57022-XX
GENERAL DESCRIPTION
The SA57022-XX has an extremely precise fixed output with a typical accuracy of 2%. It is designed to provide very low dropout and ultra low noise with an optional Bypass pin, and fast transient response. Supply current is reduced to zero (typical). The SA57022-XX incorporates both over-temperature and over-current protection. The SA57022-XX is stable with an output capacitor of only 1.0 F and has a maximum output current of 500 mA. It is available in the 7-pin small outline package (SOP002).
FEATURES
* Very low dropout voltage: 300 mV typ. (Iout = 500 mA) * High precision output voltage: 2% * Output current capacity: 500 mA * Low noise: 75 Vrms typ. @ 20 Hz to 80 KHz, for Cn = 470 pF. * Extremely good line regulation: 10 mV typical * Extremely good load regulation: 20 mV typical * Low temperature drift co-efficient to Vout: 100 ppm/C * Internal current limit and thermal shut-down circuits * Input voltage range: -0.3 V to 12 V * Wide preset output voltage range: 1.8 V to 5 V * Wide operating temperature range: -40 C to +85 C
SIMPLIFIED SYSTEM DIAGRAM
VIN
APPLICATIONS
* Battery-operated systems * Portable computers * Cameras, VCRs and camcorders * PCMCIA cards, modems, pagers * Cellular/GSM/PHS phones * Linear post-regulator for SMPS * Instrumentation
7
1
VOUT
CURRENT LIMIT DRIVER R REFERENCE
5 ON/OFF
BIAS
THERMAL SHUTDOWN R
GND 3
4 BYPASS
SL01527
Figure 1. Simplified system diagram.
2003 Oct 13
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Philips Semiconductors
Product data
500 mA LDO with ON/OFF control and Vref bypass
SA57022-XX
ORDERING INFORMATION
PACKAGE TYPE NUMBER SA57022-XXD DESCRIPTION small outline 7-pin surface mount (see dimensional drawing) VERSION SOP002 TEMPERATURE RANGE -40 to +85 C
NOTE: The device has six voltage output options, indicated by the XX on the order code. XX 18 25 28 30 33 50 VOLTAGE (Typical) 1.8 V 2.5 V 2.8 V 3.0 V 3.3 V 5.0 V
Part number marking
Each package is marked with a four letter code. The first three letters designate the product. The fourth letter, represented by `x', is a date tracking code. Part number SA57022-18 SA57022-25 SA57022-28 SA57022-30 SA57022-33 SA57022-50 Marking ALMx ALNx ALPx ALRx ALSx ALTx
PIN CONFIGURATION
PIN DESCRIPTION
PIN SYMBOL VOUT NC GND BYPASS DESCRIPTION Regulated output voltage. No connection. Ground. Reference bypass input. Connecting a 470 pF capacitor further reduces output noise. Output voltage On/Off control pin. Substrate ground pin. This pin must be connected to ground. Power supply input. 1 2
VOUT NC GND BYPASS
1 2
7
VIN
SA57022-XX
3 4
6
GND
3 4
5
ON/OFF
5
SL01525
ON/OFF GND VIN
6 Figure 2. Pin configuration. 7
MAXIMUM RATINGS
SYMBOL VIN VIN(OPR) IOUT Toper Tstg PD PD Supply voltage Operating voltage Output current Operating temperature Storage temperature Power dissipation (Note 1) Power dissipation (Note 2) PARAMETER MIN. -0.3 VOUT(typ) + 0.5 0 -40 -40 - - MAX. +12 VOUT(typ) + 10 500 +85 +150 400 950 UNIT V V mA C C mW mW
NOTES: 1. Unattached. 2. Mounted on double-sided glass epoxy PCB, with copper ground plane 192 x 142 x 1.2 mm.
2003 Oct 13
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Philips Semiconductors
Product data
500 mA LDO with ON/OFF control and Vref bypass
SA57022-XX
ELECTRICAL CHARACTERISTICS
Tamb = 25 C; VON/OFF = 1.6 V, unless otherwise specified. SYMBOL ICC ICC(OFF) VOUT PARAMETER No-load input current Input current (off) Output voltage (as % of Vnom) CONDITIONS IOUT = 0 mA VON/OFF = 0 V IOUT = 250 mA SA57022-18 SA57022-25 SA57022-28 SA57022-30 SA57022-33 SA57022-50 VIO V1 V2 VOUT/T RR Vn ION/OFF VON/OFF(H) VON/OFF(L) Dropout voltage (Note 2) Line regulation Load regulation VOUT Temperature coefficient (Note 1) Ripple rejection (Note 1) Output noise voltage (Note 1) ON/OFF pin input current ON/OFF HIGH threshold voltage ON/OFF LOW threshold voltage VIN = VOUT - 0.2 V; IOUT = 250 mA VIN = VOUT +1.5 V to VIN = VOUT +2.5 V; IOUT = 250 mA IOUT = 0 to 250 mA Tj = -30 to +85 C f = 120 Hz; Vripple = 1 V; IOUT = 250 mA fBW = 20 to 80 kHz; Cn = 470 pF VON/OFF = VIN MIN. - - 98% 1.764 2.450 2.744 2.940 3.234 4.900 - - - - 50 - 10 1.6 -0.3 TYP. 1.9 0 - 1.8 2.5 2.8 3.0 3.3 5.0 0.3 10 20 100 64 75 20 - - MAX. 5 1 102% 1.836 2.550 2.856 3.060 3.060 5.100 0.5 20 120 - - - 30 VIN+0.3 0.4 UNIT mA A V V V V V V V V mV mV ppm/C dB Vrms A V V
NOTES: 1. The parameter is guaranteed by design. 2. This parameter is not guaranteed if VOUT is less than 2 V.
2003 Oct 13
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Philips Semiconductors
Product data
500 mA LDO with ON/OFF control and Vref bypass
SA57022-XX
APPLICATION INFORMATION
VOLTAGE INPUT
CIN = 1 F CERAMIC 7 VIN 6 SUB 5 ON/OFF
VOUT 1 TO LOAD
NC 2
GND 3
BYPASS 4
COUT = 2.2 F CERAMIC
Cn = 470 pF CERAMIC
SL01526
Figure 3. Typical application circuit.
Input capacitor
An input capacitor of 1.0 F (min) should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is operated as the power source. The capacitor should be less than 1 cm from the input pin. Aluminum electrolytic or tantalum capacitor types can be used. (Because many aluminum electrolytic capacitors freeze at approximately -30 C, solid tantalums are recommended for applications operating below -25 C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques.
Thermal shutdown
Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 150 C. The regulator remains off until the die temperature drops to approximately 140 C.
Power dissipation
The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation:
P D [ V IN(max) * V OUT(min)
I LOAD(max)
Eqn. (1)
Output capacitor
Phase compensation is used to ensure stable operation even if load current varies. For this reason, an output capacitor with good frequency characteristics is needed. Set it as close to the circuit as possible, with wires as short as possible. A 1.0 F capacitor from VOUT to ground is recommended. The output capacitor should have an ESR (effective series resistance) of 5.0 or less, and a resonant frequency above 1.0 MHz.
Where: PD = worst case actual power dissipation VIN(max) = maximum voltage on VIN VOUT(min) = minimum regulator output voltage ILOAD(max) = maximum output (load) current The maximum allowable power dissipation, as shown in Equation (2), is a function of the maximum ambient temperature (Tamb(max)), the maximum allowable die temperature (125 C), and the thermal resistance from junction-to-air (Rth(j-a)). P D(max) + T j(max) * T amb(max) R th(j*a) Eqn. (2)
Optional BYPASS capacitor
A 470 pF capacitor connected from the BYPASS input to ground reduces noise present on the internal reference, which in turn significantly reduces output noise. This capacitor must have low leakage, because the pin is high impedance. If output noise is not a concern, this pin may be left unconnected. Larger capacitor values may be used, but results in a longer time period to rated output voltage when power is initially applied.
The SUB (heat sink) pin must be connected to ground with a wide trace.
PCB layout hints
The component placement around the LDO should be done carefully to achieve good dynamic line and load response. The input and noise capacitor should be kept close to the LDO. The rise in junction temperature depends on how efficiently the heat is carried away from the junction to ambient. The junction to lead thermal impedance is a characteristic of the package and fixed. The thermal impedance between lead to ambient can be reduced by increasing the copper area on PCB. Increase the input, output and ground trace area to reduce the junction-to-ambient impedance.
ON/OFF
The regulator is fully enabled when a logic HIGH is applied to this input. The regulator enters shutdown when a logic LOW is appplied to this input. During shutdown, regulator output voltage falls to zero,and supply current is reduced to 1.0 A max, and VOUT falls to zero. For use as an always-on regulator, connect ON/OFF pin to the supply voltage, as shown in Figure 3.
Optional BYPASS diode
If the voltage on the output pin rises above the input voltage, as might happen in some applications, the overcurrrent will flow via internal parasitic diodes from output to input. To prevent this, connect a bypass diode between the output and input pins.
2003 Oct 13
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Philips Semiconductors
Product data
500 mA LDO with ON/OFF control and Vref bypass
SA57022-XX
PACKING METHOD
The SA57003 is packed in reels, as shown in Figure 4.
GUARD BAND
TAPE REEL ASSEMBLY
TAPE DETAIL
COVER TAPE
CARRIER TAPE
BARCODE LABEL
BOX
SL01305
Figure 4. Tape and reel packing method
2003 Oct 13
6
Philips Semiconductors
Product data
500 mA LDO with ON/OFF control and Vref bypass
SA57022-XX
Plastic small outline package; 7 leads; body width 4.4 mm
SOP002
2003 Oct 13
7
Philips Semiconductors
Product data
500 mA LDO with ON/OFF control and Vref bypass
SA57022-XX
REVISION HISTORY
Rev _2 Date 20031013 Description Product data (9397 750 12112). ECN 853-2293 30328 of 09 September 2003. Modifications:
* Change package name from SOP-7B to SOP002 in Ordering information and Package outline sections.
_1 20011003 Product data (9397 750 08967). ECN 853-2293 27197 of 03 October 2001.
Data sheet status
Level
I
Data sheet status [1]
Objective data
Product status [2] [3]
Development
Definitions
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data
Qualification
III
Product data
Production
[1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products--including circuits, standard cells, and/or software--described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825
(c) Koninklijke Philips Electronics N.V. 2003 All rights reserved. Printed in U.S.A. Date of release: 10-03
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
Document order number:
9397 750 12112
Philips Semiconductors
2003 Oct 13 8

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